CharacterizationVisEra’s wafer level characterization service at engineering stage could significantly reduce the development cycle time and cost. With our thorough characterization ability from CP, QE(quantum efficiency) to Angle response testing, customers could get data information after our process at wafer level, rather than die level at FT stage, and could get cost benefit from the rework before packaging.
|Wafer level CP||Uniformity
|Wafer level QE (WLQE)||QE
Photo transfer curve (PTC)
|Wafer level angel response (WLAR)||Chief ray angle (CRA)
Phase Detection Auto Focus (PDAF)