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Wafer Level CCM

Wafer Level CCM

VisEra pioneered in integrating semiconductor manufacturing technology, optical design and CMOS image sensor processing for wafer-level lens technology on 8” glass wafer. After lens replication, stacking and dicing process, over two hundreds lens cubes can be made in a wafer-level batch processing. Comparing with conventional CCM technology, the benefits are simplified and batch process compatible to Si technology, small dimensions, high productivity and low cost solution. Furthermore, all the lens materials are reflowable. The camera module can be mounted to phone board directly and efficiently along with other electronic devices using standard SMT tools.

Comparison of Conventional mobile phone camera module with wafer lens moduleComparison of Conventional mobile phone camera module with wafer lens module
CCM Assembly Process FlowCCM Assembly Process Flow