Packaging and Assembly
CMOS Image Sensor (CIS) is an imaging device that performs the role of an electronic film in digital photographing equipments. It is used mostly in camera phones and other image applications. Extra circuitry next to each photo sensor converts the light energy into a voltage, and other circuitry converts the voltage to digital data. Our company provides solution of CSP, WLCSP, CLCC, PLCC, QFP, and RW for various types of applications:
- CSP: notebook camera, cell-phone camera
- WLCSP: notebook camera, cell-phone camera
- CLCC, PLCC: security surveillance
- QFP: automotive
- RW: high-end electronic devices
Discrete Package
Wafer-Level Package
CSP Package - courtesy of Xintec. Inc
ShellOP CSP Package Cross Section (Cavity Type), courtesy of Xintec, lncReconstructed Wafer (RW)
Sensor wafers are tested, back-side ground to customer specified thickness, diced, and known-good-dies picked and placed onto a frame.
