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LED Package

LED Package

VisEra developed wafer based high power LED package by leveraging its core competitiveness in optical and silicon package technologies.

Technology LED package silicon wafer base high power LED package 8” silicon wafer base high power LED package

Comparing to traditional package types, VisEra’s silicon-based package technology has additional benefits in thermal dissipation, reliability (due to silicon’s compatible CTE with LED chip), consistent CCT performance (due to conformal phosphor coating), miniaturization (wafer level lens molding & MEMS processing), and flexible customization for multi-chip layout.

Thermal dissipation
Technology LED package Thermal dissipation capability thermal resistance reaches < 5℃/W Thermal dissipation capability: thermal resistance reaches < 5℃/W
Reliability
Compatible CTE performance: reliable package platform & robust structure
Technology LED package Compatible CTE performance reliable package platform and robust structure
Consistent CCT Performance
Compatible CTE performance : reliable package platform & robust structure
Technology LED package Conformal phosphor coating technology good CCT control and high CRI
Miniaturization
Wafer level lens molding technology : high productivity & good lens shape control
Technology Wafer level lens molding technology high productivity and good lens shape control
Customization for multi-chip layout

Flexible customization : conceptual design for multi-chip

LED