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Introduction
VisEra provides LED package foundry service based on our state-of-art production technology and semiconductor manufacturing experiences. VisEra developed the LED package technologies with excellent thermal resistance, well controlled bin and customized optical lens. By quality management system (QMS), continuous improvement plans (CIP), internal training, audit and certifications, VisEra continues to improve product quality towards total customer satisfactions. Through product engineering service, VisEra provides yield monitoring, failure analysis and yield improvement. We can also tailor customers’ needs by providing “Phase-in” for specific requirements as customers own the technology.

VisEra’s R&D team has created cutting-edge solutions for LED package manufacturing platform with innovative technologies with the following features:
- Thermal resistance as low as 2C/W package is achievable on single chip component
- Patented miniaturization semiconductor MEMS process
- Fast ramp up with cost effective manufacturing by through silicon via for interconnect, lens molding on substrate and unique conformal phosphor coating on substrate
- Low junction temperature (<50C at Ta=25C)

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