主辦單位：LEDinside
協辦單位：台灣工業技術研究院 電子與光電研究所 & Witsview
日期：2009年11月24 -25日
時間：上午九點半至下午五點
地點：台大醫院國際會議中心 201
地址：台北市中正區徐州路2號

Day 2 (11/25)
LED TV、車用LED及顯示屏等熱門應用；全球LED及LED背光市場報告；中國「十城萬盞」專案現況

Session: 6
Session Time: 14:00-14:30
Topic: LED晶圓級封裝創新技術
Speaker: 研發暨品保組織 副總經理 謝建成博士
Abstract:
World initial 8-inch silicon wafer processed with MEMS technology is applied to LED package. Owing to the high thermal conductivity property of the silicon material, excellent thermal management is achieved and matches high power LED applications extensively. Moreover, wafer level phosphor coating with good uniformity control and well designed optical lenses enhance light extraction to target optical performance. The LED package has robust structure and highly reliable qualities. VisEra makes the mass production of the wafer level LED package attainable via current existing semiconductor fab infrastructures.